TNP #38 – SourceTronic ST2516 Micro-Ohm DC Resistance Meter Teardown, Modifications & Experiments

In this experiment Shahriar modifies a SourceTronic DC resistance meter due to its incredibly loud built-in buzzer. The instrument can sink up to 1A through a DUT and therefore measure down to micro-ohm resolution. The instrument also has offset voltage compensation capability to eliminate thermoelectric effects from bimetal contacts to the DUT. A direct measurement of the DUT current shows how the instrument is able to do this task in the background while measuring low resistances.

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TSP #229 – Stanford Research DS360 Ultra-Low Distortion Function Gen. Repair, Teardown & Experiments

In this episode Shahriar takes a look at a faulty SRS DS360 ultra-low distortion function generator. This instrument is capable of producing pure sinusoids with better than -110dB of THD!
Although the unit powers on, changing the frequency or output signal does not result in any internal relay switching and the instrument does not produce any output signal.
The block diagram of the instrument as well as the theory of operation is described before the teardown. The teardown also shows the two board design and the interface between the digital/analog boards. The fault is finally traced to a broken optoisolator IC between the two boards. Without this interface IC none of the configuration parameters from the digital board arrive to the analog subsection. The faulty part is replaced and the unit is restored. The difficult measurement of the THD is also presented using an SRS SR830 DSP lock-in amplifier.

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TNP #37 – Fluke 789 ProcessMeter Teardown, Repair & Performance Verification

In this episode Shahriar investigates the problem preventing a Fluke 789 PrceossMeter from powering on. The issue is fairly simple and is quickly identified.
The basic functionality of the instrument (DC/AC voltage, current, resistance measurements) are verified as well as the current delivery of the unit.

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TSP #228 – Biggest Microwave Components & Instrumentation Exhibition – IEEE Microwave Symposium 2023

We are back at the International Microwave Symposium 2023, this year held in San Diego, California!

https://ims-ieee.org/

The industry exhibition event was absolutely huge this year, with the latest showing in microwave, mm-wave & THz components, instrumentations & test solutions. This video covers a tiny fraction of the latest gear on display. The video is organized by vendor:

00:00 – Introductions
00:53 – Rohde & Schwarz: https://www.rohde-schwarz.com/us/
07:36 – Keysight Technologies: https://www.keysight.com/
14:21 – Anritsu: https://www.anritsu.com/en-us/
18:07 – Tabor Electronics: https://www.taborelec.com/
19:33 – LPKF: https://www.lpkfusa.com/
21:12 – Siglent: https://siglentna.com/
23:40 – Eravant: https://www.eravant.com/
27:26 – Junkosha: https://www.junkosha.com/en
30:27 – VDI: https://www.vadiodes.com/en/
31:35 – FormFactor: https://www.formfactor.com/
33:49 – HyperLabs: https://www.hyperlabs.com/
35:01 – Samtec: https://www.samtec.com/
36:36 – QuinStar: https://quinstar.com/
37:43 – MPI Corporation: https://www.mpi-corporation.com/
40:33 – Tektronix: https://www.tek.com/en
41:53 – Pickering: https://www.pickeringtest.com/en-us/
45:20 – Boonton Instruments: https://boonton.com/
48:52 – Holzworth Instrumentation: https://holzworth.com/

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TSP #227 – A 30GHz Static Frequency Divider from Fraunhofer Tutorial, Teardown & Characterization

In this episode Shahriar presents a deep dive into mm-Wave frequency divider; in particular static frequency dividers. These blocks are ubiquities in nearly every modern integrated circuits. The principle operation, circuit topologies and limitations are presented with several publications as examples.
The 30GHz static divider is then characterized extensively in both time domain and frequency domain. The measurements includes self-oscillation frequency, output waveform shape, input/output phase-noise relationship and the impact of temperature on self-oscillation frequency.
A detailed module teardown is also presented with focus on packaging techniques as well as closeup of the die. The integrated circuit is analyzed and the relationship between the schematic and layout is established.

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